SEMI-THERM 25 EXHIBITORS
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Advanced Cooling Technologies
Booth number
402
Advanced Cooling Technologies Inc. develops innovative thermal technologies and provides technology-based thermal products to customers in the electronics, energy systems, aerospace, military and government sectors. ACT specializes in custom thermal product design and fabrication. Two-phase flow heat transfer, heat pipes and advanced thermal systems are particular areas of expertise.
www.1-ACT.com
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AIM Specialty Materials
Booth number
303
AIM offers specialty materials to fulfill the requirements of a broad range of applications. AIM Specailty Materials include indium, bismuth, and gold alloys available in many forms and configurations.
www.aimspecialty.com
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alfatec GmbH & Co KG - Kerafol
Booth number
202
Alfatec GmbH & CoKG - Kerafol is an European manufacturer and offers Keratherm® /Softtherm® flexible ceramic filled thermal interface materials. For managing component level heat transfer in electronic products. High performance at low mounting pressure for lowest thermal resistance are the key factors for all the products. All Gap Fillers are high compressible and do have memory effect. Also available are high performance thermal grease products as well as silicone free materials for medical or aero-space applications. Specially designed products are ferrite based types to absorb EMI and flexible printed circuits.
alfatec.de
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ALPHA NOVATEC, INC.
Booth number
301
Since Alpha Company Ltd. was founded in 1972, we have produced cold-forged parts in a wide range of fields, including electronics components and automobile parts. In the process, we have constantly striven to develop new concepts for original technology and techniques which have earned our high reputation. In 1989, we began to apply our technology to heat sinks. Since then, we have developed high performance heat sinks previously thought impossible to make and at the same time developed MicroForging, a new technology surpassing any other forging techniques. We specialize in high performance heat sinks and precision cold forging of complex light material parts.
www.alphanovatech.com
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Analysis Tech Inc.
Booth number
501
SEMICONDUCTOR COMPONENT THERMAL TESTERS for resistance, impedance, and die-attachment using electrical-junction temperature-measurement on any device type (transient and steady state); Thermal-lab test products for component thermal characterization and contract test services. THERMAL INTERFACE MATERIAL TESTERS (TIM Testers) for thermal conductivity measurements of electronic-packaging interface-materials; test services also offered. EVENT DETECTORS for solder joint and connector reliability testing.
www.analysistech.com
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ANSYS
Booth number 300
ANSYS develops, markets, and
supports engineering simulation software used to predict how product designs
will operate and how manufacturing processes will behave in real-world
environments. The Company continually advances simulation solutions by,
first, developing or acquiring the very best technology; then integrating it
into a unified and customizable simulation platform that allows engineers to
efficiently perform complex simulations involving the interaction of
multiple physics; and, finally, providing system services to manage
simulation processes and data — all so engineers and product developers can
spend more time designing and improving products and less time using
software and searching for data. www.ansys.com
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Anter Corporation
Booth number 407
Anter Corporation is a
manufacturer of thermal properties analyzers for measuring the thermal
conductivity, thermal expansion, thermal diffusivity and specific heat
capacity of a wide range of materials. Instruments cover a temperature range
of -180°C to 2800°C. We offer the broadest product lines of laser flash
systems and dilatometers. Testing services are available. Worldwide sales
and support. ISO9001 certification. www.anter.com
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AOS Thermal Compounds
Booth number 403
AOS Thermal Compounds is a manufacturer of dependable thermal management solutions, including thermal paste, heat sink compounds, and non-silicone grease. Common applications are found in micro-electronic, automotive, power generation and other performance-intensive markets. AOS Thermal Compounds is a leading innovator of dry-to-the touch thermal grease pads, that offer low thermal resistance without the mess of thermal grease. These products are not phase change material which offers cleaner and easier application.
www.aosco.com
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The Bergquist Company
Booth number 503
The Bergquist Company designs and manufactures high performance thermal management materials used to cool electronic components. Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad® thermally conductive interface materials; Gap Pad® gap fillers; Hi-Flow® phase change grease replacement materials; Bon-Ply® thermally conductive adhesive tapes, and Thermal Clad® insulated metal substrates.
www.bergquistcompany.com
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Celsia Technologies
Booth number
102
Celsia manufactures thermal solutions based around its NanoSpreader vapor chambers. Cost effective and remarkably thin, NanoSpreader based modules cool up to 30% better than heat pipe alternatives and can be designed to fit a wide array of applications, especially those with limited air flow or severe space constraints. Celsia’s technology is being used to cool the latest processors in 1U server and gaming systems, over-clocked or over-crowed DDR3 and FBDIMM modules, and the brightest LED enclosures.
www.celsiatech.com
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Colder Products Company
Booth number 206
Colder Products Company is the
leading provider of quick disconnect couplings, fittings and connectors for
plastic tubing. Founded in St. Paul, Minnesota in 1978, Colder has 250
employees and sales offices in nine countries. Colder's products are
designed to be simple to operate, easy to maintain and offer a unique
connection (click) featuring both quality and economy. The emphasis is
always on the design and production of new, unique products that will meet
the needs of particular market segments. Our market is very diverse, and not
one that is normally served through conventional quick-disconnect
capabilities. A significant number of Colder products are custom designed
for specific customer applications and are developed to meet individual
customer needs.
www.colder.com |
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CoolIT Systems Inc.
Booth number 203
CoolIT Systems has been working with leaders in the computer industry like Intel, AMD, and NVIDIA to research, design, and deliver next generation cooling products that provide a comprehensive solution while exceeding high OEM standards for reliability and maintenance-free operation. This carefully designed and patented technology unleashes the full potential of a PC, providing superior cooling performance while reducing system level noise and improving reliability of vital components. CoolIT MTEC Technology can be found in the top names in performance computing like Dell, Alienware, Velocity Micro, MAINGEAR, Hypersonic, Biohazard, Ultraforce, Systemax, Digital Storm, Cyber Power, AVA Direct, BOXX & Commodore Gaming.
www.coolITsystems.com
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CPS Technologies
Booth number
205
CPS is the World Leader in providing AlSiC thermal management materials and electronic packaging designs and products for the microelectronics and power electronics industries. Applications include pin fin coolers for IGBT modules in Hybrid Electric Vehicles; Motor Control (Controller) power modules, Hi-Rel DC/DC converters, High Voltage Power Factor Correction (PFC) front ends; Uninterruptible Power Supplies (UPS), and many others.
www.alsic.com
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Dow Corning Corporation
Booth number
400
Dow Corning Electronics - Offers a full line of Thermal Interface Materials backed by industry-leading global manufacturing, sales and application support. It’s easy to do business with Dow Corning. We understand your needs and bring new ideas to market. To learn more: www.dowcorning.com\electronics Contact: David Hirschi, Global Marketing Manager, david.hirschi@dowcorning.com.
www.dowcorning.com |
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Electronic Cooling Solutions
Booth number 200
ECS provides services for companies in a wide variety of industries and applications. Our customers develop products for the avionics, consumer, computing, medical, networking and telecommunications industries. Special needs can also be addressed, such as cooling the electronics for a unique telescope, and the thermal issues in manufacturing processes.
www.ecooling.com
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ElectronicsCooling Magazine
Booth number
106
ElectronicsCooling magazine is a unique publication providing practical
information and advice exclusively on thermal management of electronics.
Over the past 13 years, ElectronicsCooling magazine has established an
excellent reputation for high-quality, vendor-independent technical articles
and news coverage. ElectronicsCooling magazine is a global publication
issued quarterly in February, May, August and November and delivered free of
charge by request only to subscribers who complete a subscription form. The
web site is updated soon after the printed magazine is issued and includes
all articles published in the magazine in fully-searchable electronic form.
ElectronicsCooling magazine is supported by advertisers who are welcome to
advertise in the magazine, on the web site, or both. www.electronics-cooling.com |
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element 6
Booth number
404
Element Six is a global leader
and innovator in supermaterials with a history spanning more than 50 years.
Our products are used across a wide range of industries. Element Six’s
activities are organized into four distinct areas – Advanced Materials, Hard
Materials, Oil & Gas and Technologies plus a venture capital fund to invest
in innovative activities related to our businesses. The company has
production sites in China, South Africa, Sweden, The Netherlands, Ukraine,
Germany, Ireland and the UK with a global sales organisation, research,
technical support and service network. www.e6.com |
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Fujipoly America Corp.
Booth number 101
Fujipoly is a global company with locations in North America, Europe, Japan, Thailand, Singapore, China and Hong Kong. Our thermal management materials range in performance to suit your application. We specialize in thin films, gold fillers, putty, paste and grease.
www.fujipoly.com
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Future Facilities
Booth number
308
Future Facilities announces the release of 6SigmaET, the next generation CFD based software for thermal design in electronics and the first major breakthrough for a thermal design tool in 10+ years! 6SigmaET features a highly efficient, 3rd generation modeling environment that significantly improves analysis-based thermal design from concept to final implementation. In addition, 6SigmaET, as a key module of the 6SigmaDC suite that supports the important trend toward integrated design of electronics and data centers.
www.futurefacilities.com
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Henkel Corporation
Booth number 302
Henkel is the world’s leading supplier of advanced materials for next-generation electronics assembly and packaging applications. From wafer-level to board-level through to final assembly, Henkel’s world-renowned Hysol®, Loctite® and Multicore® product portfolios provide today’s electronics specialists with the proven, reliable and compatible material solutions they need to stay competitive.
www.henkelna.com/electronics |
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IEEE Components, Packaging and Manufacturing Technology Society (Santa Clara Valley Chapter)
Booth number 108
The IEEE CPMT Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems and photonics packaging and manufacture.
If you’re looking for technical excellence, professional development and international networking opportunities, the CPMT Society can help you through its journals, conferences and workshops, committee activities, local chapter events, educational programs and awards. Our local SCV chapter is quite active, with a regular series of Monthly Luncheon and Evening Meetings and a rich choice of technical and professional skills courses. sign up for our ListServ Dlist to receive meeting notices.
www.cpmt.org/scv
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Indium Corporation
Booth number
201
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001.
www.indium.com
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Jenoptik
Booth number
502
State-of-the-art Thermal
Imaging Solutions: Thermographic camera systems of the VarioCAM® high
resolution family and IR-TCM infrared camera modules by Jenoptik, a leading
manufacturer, stand out for image quality, resolution, ergonomic handling
and long-time reliability. Especially in electronics R&D and manufacturing
processes, the innovative infrared imaging systems are essential tools for
thermal design, thermal characterization testing, inspection and quality
control of electronic components and systems. Product Highlights: + Spatial
resolution up to 1.2 megapixel + Thermal resolution better than 70 mK +
Long-time performance in terms of reproducibility and homogenity + Great
variety of IR optics available (wide angle, tele, macro). The thermal camera
systems and IR optics are developed and manufactured in Germany by ESW GmbH,
a company of JENOPTIK I Defense & Civil Systems (www.jenoptik.com/dcs) and
leading manufacturer of thermographic and thermal imaging systems. North
America residents might want to contact our United States subsidary:
JENOPTIK Optical Systems, Inc. I 16490 Innovation Drive I Jupiter, FL 33478.
www.jenoptik.com/infraredtechnology |
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Mentor Graphics - Mechanical Analysis Division
Booth number 100
FLOTHERM is a powerful 3D-CFD simulation software for thermal design of electronic components and systems. FLO/PCB is an analysis tool for thermal design of printed-circuit boards. T3Ster (Trister) is an advanced thermal tester for thermal characterization of semiconductor chip packages which uses smart implementation of the JEDEC static-test method (JESD51-1).
www.mentor.com/mechanical
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Microsanj
Booth number
207
Microsanj is a leading provider
of high-resolution transient thermal imaging services and solutions
for both commercial and research applications. The system is based on
optical thermoreflectance characterization; digital signal processing and
advanced patented software algorithms that supports electronic and
optoelectronic components measurement, thermal design validation of ICs,
defects and failure analysis and biological samples.
www.microsanj.com
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Mintres BV
Booth number 404
Mintres BV
is a company specializing in shaping and, if required, coating and
assembling ceramic components for a number of industries. Mintres BV has
more than 100 years accumulated experience in this field and its workforce
has developed many advanced processing techniques and authored many patents.
Our specialty is co-development of a product with a customer and then taking
it to high volume production although production to drawing is also
possible. Please come and see us at SEMI-THERM 27 and let us know, how we
can be of help.
www.mintres.com
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Momentive Performance Materials
Booth number
306
Momentive Performance Materials offers a family of thermal management products for today's high power electronics, ranging from PolarTherm* boron nitride powders to highly-conductive TPG* thermal pyrolytic graphite materials and composites. PolarTherm boron nitride powders offer a unique combination of thermal, electrical, and mechanical properties that make them excellent candidates for use in a range of thermal management materials, including gap fillers and underfills, potting and molding compounds, silicone and other compliant pads, liquid encapsulants, and compounded thermoplastics. Highly-conductive TPG thermal pyrolytic graphite materials and TC1050* thermal cores offer solutions for high performance heat spreading and dissipation requirements. These passive technologies, exhibiting thermal conductivities from 2.5 to 4 times that of copper, can provide unique solutions for high performance heat spreading and dissipation needs. *PolarTherm, TPG, and TC1050 are trademarks of Momentive Performance Materials, Inc.
www.momentive.com
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Shin-Etsu MicroSi
Booth number
500
Shin-Etsu MicroSi- Inc.- together with our parent company Shin-Etsu Chemical Co.- Ltd. represent world-class leadership in the development and manufacture of specialty materials for the semiconductor industries. Our product lines are specifically designed to address today's photolithography- packaging and flexible printed circuit requirements.
www.microsi.com
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Software Cradle Co, Ltd.
Booth number 401
Software Cradle Co. Ltd. (Osaka, Japan), a leading developer and service provider of CFD software, is delighted to exhibit award-winning CFD software designed for design engineers as well as CFD experts. Established in 1984, Software Cradle offers a suite of CFD products consisting of SC/Tetra (general purpose, unstructured mesh CFD), STREAM (general purpose, structured mesh CFD), HEAT Designer (structured mesh CFD specialized for electronics cooling) and CADthru (CAD to CFD geometry translation). Software Cradle products are distributed and supported worldwide by its offices in Japan and North America (Cradle North America, Dayton, OH), and distributors throughout Asia, North America and Europe. In this conference, Cradle will mainly exhibit HEAT Designer which is used by majority of Japanese electronics companies that are utilizing CFD in their design process. Its outstanding operationablity, fast and stable computation, ability to handle thousands of parts, flexibility and powerful postprocessor have been contributing to the innovation of Japanese electronics technologies. These traits enable users to import real CAD data and simulate as it is. Some of the users utilize 100 to 200 million meshes on windows platform. Please come and visit our booth or workshop to find out how HEAT Designer could maximize your work.
cradle.co.jp
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sp3 Diamond Technologies, Inc.
Booth number 307
sp3 Diamond Technologies provides thin- and thick-film diamond products and deposition services to companies world-wide with a focus on DiaTherm™ heat spreaders for device thermal management and diamond-on-silicon applications for chip-level heat mitigation. The company also supplies Hot Filament CVD Diamond Deposition Reactors. sp3’s corporate headquarters and thin-film diamond deposition facility are located in Santa Clara, California. sp3’s thick-film facility, sp3 Ltd., is located in Calgary, Alberta, Canada.
www.sp3diamondtech.com
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Staubli Corporation
Booth number 202
Stäubli is a leading manufacturer of textile machinery, quick release
couplings and robotics systems. With a workforce of over 3500 employees
Stäubli is present in 25 countries supported by a comprehensive distribution
network in 50 countries worldwide. Stäubli's North American headquarters is
located in Duncan, South Carolina and has over 200 employees supporting
Textile, Connectors and Robotics customers, with a dynamic sales force
strategically placed from the East Coast to the West Coast, Canada and
Mexico.
www.staubli.com |
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Taica Corporation
Booth number
405
We, at Taica, are R&D oriented companies, to create new businesses and to be
specialists with unique technologies. Our company name “Taica” reflects our
wishes of “大翔,
Big Flight”, “大化,
Big Change” and “大華, Big Flower”. We keep
on challenging all over the world to make big leap, to expand ourselves with
revolutionary technologies and to achieve a successful outcome. While
complying with laws and regulations, Taica is seeking to cultivate clear and
pleasant corporate culture and to ensure transparency to customers and
society. Taica is also making efforts to establish a working environment in
which all employees can work happily and in good time, to contribute to make
their lives better. By doing so, Taica is striving to maintain stability and
growth potential for enterprise continuity.
www.taica.co.jp |
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Thermal Engineering Associates
Booth number
200
TEA is a company founded by Bernie Siegal, a 35+-year veteran and recognized technical leader in the semiconductor thermal field. The company's mission is to provide a central source for the products and services necessary for proper semiconductor thermal measurement and modeling and solutions to attendant thermal management problems. Through its own products and services, augmented by an extensive network of technical experts around the world, TEA can assist customers in finding solutions. The Tech Briefs and Hot Links pages provide useful information to those interested in semiconductor and electronics thermal issues. We welcome the opportunity to discuss your thermally-related measurement, modeling and/or management requirements.
www.thermengr.net |
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Thermo Cool Corporation
Booth number 309
Thermo Cool is a
technology-driven company dedicated to providing thermal management
solutions for your power devices. Our mission is to help our customers
address thermal issues at all stages from product design to manufacturing.
Thermo Cool is able to provide high precision, diverse cooling solutions
manufactured in our ISO9002, QS9000 certified factories. Capacity is in
place to handle large production requirements.
chrisoz@thermocoolcorp.com |
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Thermotek, Inc.
Booth number 105
ThermoTek has been a leader in the industrial and
medical device industry for over eighteen years. With our innovative design
for precision thermal management solutions and numerous patents on our
technology, ThermoTek continues to push the envelope with new product
offering. ThermoTek manufactures thermal management systems for precise
temperature control with solid state recirculating chillers from 150 to 1200
watts of cooling power in small portable packages. The ThermoTek PhasePlane
aluminum extruded heat pipes, designed for mass manufacturability, have
greater performance over traditional heat pipe systems in all mounting
orientations.
www.thermotekusa.com |
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Thermshield, LLC
Booth number 304
Thermal management products for
the electronics cooling market including heat sinks, skived and stack fin,
heat pipe assemblies, extrusions, stampings, water-cooled plates, fans and
other support equipment. Thermal design and design for low cost
manufacturing is our specialty.
www.thermshield.com
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TTM Corp.
Booth number 208
TTM Provides epochal thermal management
solutions with cutting edge technology based products and engineering
service for variety types of electronics worldwide. Targeting advanced
technology based thermal management products development, TTM performed a
pinpointed market research for semiconductors including CPU, GPU and Memory,
LEDs for lighting and BLU and Digital Convergences while inviting highliy
skilled Nano technology engineers in 2009.
www.coolttm.com
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Vacuum Process Engineering, Inc.
Booth number 103
Since 1976, Vacuum Process
Engineering has specialized in various braze processes including vacuum
brazing, hydrogen brazing, induction brazing, infrared brazing, and
diffusion bonding. Other materials joining processes employed include
diffusion bonding. We also offer vacuum bake-out, thin film coatings and
critical heat treating of refractory and specialty metals under the
requirements of the ISO 9001:2008 quality assurance system. Our Engineering
Staff can tackle your project whether it's research and development work,
production quantities or complete turnkey fabrication. We have years of
experience in material science, problem analysis, production methodology and
fabrication design. Our Production Staff has a proven track record of high
quality output and on-time delivery. Whether your project is for one piece
or thousands we are ready to help you succeed.
www.vpei.com |
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Wolverine Tube, Inc.
Booth numbers 408
Wolverine Tube, Inc. is a world-class manufacturer of copper and copper alloy tubes, fabricated components and assemblies, metal joining products, copper and copper alloy rod and bar products, as well as highly enhanced heat transfer tubes. Micro-Deformation Technology (MDT) is a patented machining process that was originally developed for the production of highly enhanced heat transfer tubes at Wolverines and has been adapted to efficiently process superior quality, low cost micro-channels. The MDT process can achieve a variety of channel depths, channel widths, fin shapes and angularity. MDT provides design engineers a unique, cost-effective alternative to create new components and expand available materials for thermal management hardware applications. With the capability of fabrication and assembly, Wolverine's China facility can build full cooling systems.
www.wlv.com
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