PSS NEWS

Package Science is Expanding!

Package Science Services is proud to announce our co-location with Thermal Engineering Associates at our new location in Santa Clara.  The new facility has advanced capability for package development, including thermal and electrical modeling and measurements, design, and simulation.  Bernie Siegal, TEA President is an industry leader in development of instrumentation and standards for thermal test of semiconductors.  The combined labs and personnel provide a unique capability with knowledge and tools that can help you with your packaging and thermal needs from the chip to the system.

3287 Kifer Road, Santa Clara, CA, 95051

 

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