Package Science Services
IC Packaging Specialists
Latest News
May 2012
MDAM GROUP
The Microelectronic Design and Measurement Group (MDaM Group) is a collaborative effort between Thermal Engineering Associates (TEA), Packaging Science Services (PSS), and Microsanj LLC to bring together the complementary expertise of the three companies to provide you with a resource for consulting services, solutions, and products designed to enhance the performance and reliability of your microelectronic components and electronic systems.
PSS Brochure
Click HERE to see the PSS Sales Brochure and learn more about Package Science
NEW LABS AND OFFICE
Package Science co-locates with Thermal Engineering Associates...more
Thermal Test Chips Available!
Thermal Test chips available from Thermal Engineering Associates more
Packaging Presentations
DESIGN OF HIGH-DENSITY PACKAGING; TOOLS AND KNOWLEDGE
PSS Mission and Capabilities
Our mission is to provide best-in-class package engineering services from concept through mass production of high technology integrated circuits and related products. Using our extensive inventory of hardware and software tools and over 25 years experience in microelectronic and optical package engineering, PSS can help to provide a solution for a broad array of design and performance problems.
PSS provides turnkey support for all types of IC and device packaging:
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Package selection based on form factor, cost and performance criteria· Design and layout for wire bond, flip-chip, 3D, SIP
· Electromagnetic modeling, simulation and measurement tools
· Thermal modeling, simulation and measurement tools
· Material set selection
· Assembly process development
· Prototype assembly
· Qualification / Reliability plan
· Transfer to mass production
· Failure analysis and physical deconstruction
Expert packaging, design, materials and supply chain personnel are on board to completely support the packaging process and work with your device and engineering staff to match your needs with the right package and supplier for your prototype and volume IC packaging needs. Our goal is to serve semiconductor companies that need a knowledgeable, veteran staff to take the worry and learning curve out of packaging complex products. We also support services at any point in the packaging chain with a full array of software, hardware and measurement tools.
© 2011 Package Science Services LLC